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FDS6690AS - onsemi

Description: Obsolete - N-Channel PowerTrench MOSFET 30V, 9A, 11.5mΩ

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FDS6690AS - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - package so-8*
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FDS6690AS Details

  • Manufacturer Part Number:

    FDS6690AS

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    100 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    43 ns

  • Turn-on Time-Max (ton):

    40 ns

FDS6690AS Frequently Asked Questions (FAQs)

  • The FDS6690AS can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • To ensure proper biasing, connect the gate to a voltage source through a resistor (e.g., 1 kΩ) and ensure the drain-source voltage is within the recommended range (typically 10-20 V).
  • Use a thermal pad on the bottom of the package, and ensure good thermal conductivity between the pad and the PCB. A thermal via or thermal plane can also be used to improve heat dissipation.
  • Yes, the FDS6690AS is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout and decoupling to minimize parasitic inductance and capacitance.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Handle the device by the body or use an anti-static wrist strap to prevent ESD damage.

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FDS6690AS Overview

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Part Image FDS6690SF011 Fairchild Semiconductor Corporation

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