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FDS6911 - onsemi

Description: Obsolete - Dual N-Channel Logic Level PWM Optimized PowerTrench MOSFET 30V, 6A, 28mΩ

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FDS6911 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8-1
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FDS6911 - onsemi  - 3D model - Small Outline Packages - SOIC-8-1
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FDS6911 Details

  • Manufacturer Part Number:

    FDS6911

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SO-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    7.5 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS6911 Frequently Asked Questions (FAQs)

  • The maximum current rating of the FDS6911 is 1.5A per channel, but it's recommended to derate the current to 1.2A per channel for reliable operation.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. Also, make sure to decouple the VCC pin with a 10uF capacitor to reduce noise and ensure stable operation.
  • For optimal thermal management, use a thermal pad on the bottom of the package and connect it to a solid ground plane. Also, keep the layout as compact as possible, and use a 4-layer PCB with a solid ground plane to reduce thermal resistance and electromagnetic interference (EMI).
  • To protect the FDS6911 from ESD, use an ESD protection device such as a TVS diode or a Zener diode on the input lines. Also, ensure that the PCB is designed with ESD protection in mind, and handle the device with an ESD wrist strap or mat during assembly.
  • The recommended operating temperature range for the FDS6911 is -40°C to 125°C. However, the device can operate up to 150°C with reduced performance and reliability.

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FDS6911 Overview

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