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FDS86240 - onsemi

Description: RoHS Compliant; 100% UIL Tested; Max rDS(on) = 19.8 mΩ at VGS = 10 V, ID = 7.5 A; High Power and Current Handling Capability in a Widely Used Surface Mount Package; Max rDS(on) = 26 mΩ at VGS = 6 V, ID = 6.4 A; High Performance Trench Technology for Extremely Low rDS(on)

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FDS86240 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8
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FDS86240 - onsemi  - 3D model - Small Outline Packages - SOIC 8
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FDS86240 Details

  • Manufacturer Part Number:

    FDS86240

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    7.5 A

  • Drain-source On Resistance-Max:

    0.0198 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS86240 Frequently Asked Questions (FAQs)

  • The FDS86240 can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Also, ensure the input voltage (VIN) is within the recommended range of 2.5V to 5.5V.
  • To minimize EMI, use a multi-layer PCB with a solid ground plane, and keep the FDS86240 away from high-frequency signal traces. Also, use a decoupling capacitor (e.g., 100nF) between VCC and GND, and another between VEE and GND.
  • Yes, the FDS86240 is suitable for high-speed switching applications due to its fast switching times (tON = 10ns, tOFF = 20ns) and low propagation delay (tpd = 10ns). However, ensure proper PCB layout and decoupling to minimize ringing and overshoot.
  • To protect the FDS86240 from ESD, use an ESD protection device (e.g., TVS diode) on the input pins, and ensure proper handling and storage procedures are followed during manufacturing and assembly.

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Part Image FDS86240 Rochester Electronics LLC

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Part Image FDS86240 Fairchild Semiconductor Corporation

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