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FDS86242 - onsemi

Description: 100% UIL Tested; Max rDS(on) = 67 mΩ at VGS = 10 V, ID = 4.1 A; High performance trench technology for extremely low rDS(on); Max rDS(on) = 98mΩ at VGS = 6 V, ID = 3.3 A; RoHS Compliant; High power and current handling capability in a widely usedsurface mount package

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FDS86242 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-1
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FDS86242 - onsemi  - 3D model - Small Outline Packages - SO-8-1
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FDS86242 Details

  • Manufacturer Part Number:

    FDS86242

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    4.1 A

  • Drain-source On Resistance-Max:

    0.067 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS86242 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 18V). Use a stable voltage regulator and decoupling capacitors to minimize noise and ripple.
  • The maximum allowed current through the internal diode (D1) during startup is 1A. Exceeding this may cause damage to the device.
  • Use a soft-start circuit or a voltage supervisor to control the power-on and power-off transitions. This helps prevent latch-up and ensures a stable output voltage.
  • Use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device, such as the NUP2105L, to protect the FDS86242 from electrostatic discharge.

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FDS86242 Overview

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