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FDS86252 - onsemi

Description: Max rDS(on) = 80 mΩ at VGS = 6 V, ID = 3.7 A; 100% UIL Tested; High power and current handling capability in a widely used surface mount package; Max rDS(on) = 55 mΩ at VGS = 10 V, ID = 4.5 A; High performance trench technology for extremely low rDS(on); RoHS Compliant

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FDS86252 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-1
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FDS86252 - onsemi  - 3D model - Small Outline Packages - SO-8-1
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FDS86252 Details

  • Manufacturer Part Number:

    FDS86252

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS86252 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDS86252 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and consider using a voltage regulator to maintain a stable voltage supply.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and consider using thermal vias and heat sinks to dissipate heat. Follow the recommended PCB layout guidelines in the datasheet.
  • Use a logic analyzer or oscilloscope to monitor the device's signals, and check for proper power supply, clock, and data signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.
  • Follow proper PCB layout and shielding techniques, use EMI filters and shielding components as needed, and ensure the device is properly decoupled and bypassed to minimize EMI emissions.

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FDS86252 Overview

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