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FDS8958A - onsemi

Description: High power and handling capability in a widely usedsurface mount package ; Fast switching speed ; Q1: N-Channel 7.0 A, 30 V RDS(ON) = 28 mΩ @ VGS = 10 V RDS(ON) = 40 mΩ @ VGS = 4.5 V ; Q2: P-Channel -5 A,-30 V RDS(ON) = 52 mΩ @ VGS = -10 V RDS(ON) = 80 mΩ @ VGS = -4.5 V

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FDS8958A - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8_8
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FDS8958A - onsemi  - 3D model - Small Outline Packages - SOIC8_8
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FDS8958A Details

  • Manufacturer Part Number:

    FDS8958A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Date Of Intro:

    2017-09-22

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS8958A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate correctly. Ensure VIN is within the recommended range (4.5V to 18V) and VBIAS is set to 2.5V ± 0.5V.
  • The FDS8958A can handle a maximum continuous current of 3A per channel, with a peak current of 6A for 10ms. Ensure proper thermal design and heat sinking to prevent overheating.
  • Use a voltage regulator or a voltage supervisor to ensure the input voltage (VIN) remains within the recommended range. Add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients.
  • Use a TVS (Transient Voltage Suppressor) diode or a zener diode with a voltage rating of 5.5V or higher to protect the device from electrostatic discharge (ESD) events.

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FDS8958A Overview

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