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FDS8958B - onsemi

Description: Q2 P-Channel Max. RDS(on) = 51 mΩ at VGS = -10 V, ID = -4.5 A Max. RDS(on) = 80 mΩ at VGS = -4.5 V, ID = -3.3 A; RoHS Compliant; HBM ESD protection level > 3.5 kV; Q1 N-Channel Max. RDS(on) = 26 mΩ at VGS = 10 V, ID = 6.4 A Max. RDS(on) = 39 mΩ at VGS = 4.5 V, ID = 5.2 A

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PCB Footprints
FDS8958B - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead, SOIC,JEDEC MS-012, .150-inch Narrow Body
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3D Models
FDS8958B - onsemi  - 3D model - Small Outline Packages - 8-Lead, SOIC,JEDEC MS-012, .150-inch Narrow Body
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FDS8958B Details

  • Manufacturer Part Number:

    FDS8958B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    18 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.4 A

  • Drain-source On Resistance-Max:

    0.026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    32 ns

  • Turn-on Time-Max (ton):

    20 ns

FDS8958B Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the device away from heat sources and ensure good airflow.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V), and the output voltage is set correctly using the FB pin. Also, ensure the input capacitor is properly sized and placed close to the device.
  • The maximum current rating is 3A, but it's recommended to derate the current to 2.5A for optimal reliability and thermal performance.
  • The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. To handle this, ensure good thermal design, and consider adding thermal monitoring and shutdown circuitry.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended, placed as close to the VIN pin as possible.

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