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FDS8978 - onsemi

Description: RDS(ON) = 18 mΩ, VGS = 10V, ID = 7.5A; RoHS Compliant; RDS(ON) = 21 mΩ, VGS = 4.5V, ID = 6.9A ; Low gate charge; High power and current handling capability; High performance trench technology for extremely low RDS(ON); 100% Rg Tested

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FDS8978 Details

  • Manufacturer Part Number:

    FDS8978

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    57 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.9 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Pulsed Drain Current-Max (IDM):

    49 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS8978 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Bias the FDS8978 with a stable voltage source (e.g., 5V) and ensure the input voltage is within the recommended range (4.5V to 5.5V). Use a 10uF capacitor for input decoupling and a 100nF capacitor for output decoupling.
  • The FDS8978 can handle up to 3A of continuous current. However, it's recommended to derate the current handling capability based on the ambient temperature and PCB thermal design.
  • Use a voltage supervisor or a voltage monitor IC to detect overvoltage and undervoltage conditions. Add a TVS diode or a zener diode to protect the FDS8978 from voltage transients and spikes.
  • Use a TVS diode or a zener diode with a voltage rating of 5.5V or higher to protect the FDS8978 from electrostatic discharge (ESD).

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FDS8978 Overview

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