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FDS8984 - onsemi

Description: Low gate charge ; Max rDS(on) = 30mΩ, VGS = 4.5V, ID = 6A ; RoHS Compliant ; 100% RG tested ; Max rDS(on) = 23mΩ, VGS = 10V, ID = 7A

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FDS8984 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB
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FDS8984 Details

  • Manufacturer Part Number:

    FDS8984

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    32 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    100 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    102 ns

  • Turn-on Time-Max (ton):

    28 ns

FDS8984 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the device away from heat sources and ensure good airflow.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V). Use a stable voltage regulator and decouple the input with a 10uF capacitor.
  • The maximum current rating is 1.5A per channel. However, it's recommended to derate the current to 1.2A per channel for optimal reliability and thermal performance.
  • Use a TVS diode or a zener diode to clamp the input voltage. Add ESD protection devices, such as a transient voltage suppressor (TVS) or a diode array, to protect the device from electrostatic discharge.
  • The recommended operating temperature range is -40°C to 125°C. However, the device can operate up to 150°C with reduced performance and reliability.

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FDS8984 Overview

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