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FDY100PZ - onsemi

Description: ESD protection diode (note 3); RoHS Compliant; -350 mA, -20 V; RDS(ON) = 1.6 W @ VGS = – 2.5 V; RDS(ON) = 1.2 W @ VGS = – 4.5 V

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Symbol
FDY100PZ - onsemi - PCB symbol
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PCB Footprints
FDY100PZ - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - 3 lead flat lead*-1
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3D Models
FDY100PZ - onsemi - 3D model - SO Transistor Flat Lead - 3 lead flat lead*-1
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FDY100PZ Details

  • Manufacturer Part Number:

    FDY100PZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-523FL

  • Package Description:

    SC-89, 3 PIN

  • Manufacturer Package Code:

    419BG

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTION

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    1.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.625 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDY100PZ Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • A ceramic capacitor with a value of 1-10uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • Use a TVS (Transient Voltage Suppressor) diode or a zener diode to protect the device from overvoltage conditions. Additionally, consider using a current limiting resistor or a fuse to protect against overcurrent conditions.
  • A ceramic capacitor with a value of 1-10uF is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize noise and ensure stable operation.

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FDY100PZ Overview

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