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FDY3000NZ - onsemi

Description: 600 mA, 20 V ; RDS(ON) = 850 mΩ @ VGS = 2.5 V; ESD Protection Diode (note 3); RoHS Compliant; RDS(ON) = 700 mΩ@ VGS = 4.5 V

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FDY3000NZ - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - FDY3000NZ
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FDY3000NZ - onsemi  - 3D model - SO Transistor Flat Lead - FDY3000NZ
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FDY3000NZ Details

  • Manufacturer Part Number:

    FDY3000NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-563

  • Package Description:

    SC-89, 6 PIN

  • Manufacturer Package Code:

    419BH

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTION

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.6 A

  • Drain-source On Resistance-Max:

    0.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.625 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDY3000NZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the device is properly bypassed and decoupled to minimize high-frequency noise. Also, consider the device's switching characteristics and layout parasitics.
  • Use a fuse or a current-limiting resistor in series with the device. Also, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits.

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FDY3000NZ Overview

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