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FDY300NZ - onsemi

Description: RDS(ON) = 850 mΩ @ VGS = 2.5 V; 600 mA, 20 V ; RDS(ON) = 700 mΩ @ VGS = 4.5 V ; ESD Protection Diode (note 3); RoHS Compliant

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PCB Footprints
FDY300NZ - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - FDY300NZ
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FDY300NZ - onsemi  - 3D model - SO Transistor Flat Lead - FDY300NZ
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FDY300NZ Details

  • Manufacturer Part Number:

    FDY300NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-523FL

  • Package Description:

    ROHS COMPLIANT, SC-89, 3 PIN

  • Manufacturer Package Code:

    419BG

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTION

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.6 A

  • Drain-source On Resistance-Max:

    0.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.625 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDY300NZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the device.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V for reliable operation.
  • Yes, but be aware of the device's switching losses and ensure proper PCB layout and decoupling to minimize EMI and ringing.
  • Use a TVS diode or a zener diode for overvoltage protection, and consider adding a current sense resistor and a fuse for overcurrent protection.

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FDY300NZ Overview

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