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FF450R17ME4 - Infineon

Description: EconoDUAL™3modulewithTrench/FieldstopIGBT4andEmitterControlled3diodeandNTC 1700V 450A

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FF450R17ME4 - Infineon PCB footprint - Other - Other - FF450R17ME4-2
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3D Models
FF450R17ME4 - Infineon  - 3D model - Other - FF450R17ME4-2
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FF450R17ME4 Details

  • Manufacturer Part Number:

    FF450R17ME4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Pin Count:

    11

  • Country Of Origin:

    Germany, Hungary, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    600 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X11

  • Number of Elements:

    2

  • Number of Terminals:

    11

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2500 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1600 ns

  • Turn-on Time-Nom (ton):

    380 ns

  • VCEsat-Max:

    2.3 V

FF450R17ME4 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 175°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ.
  • A gate drive circuit with a resistive divider network and a gate resistor (RG) of 10-20 ohms is recommended. This ensures proper voltage switching and minimizes ringing.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage from voltage spikes and excessive current. Use a voltage supervisor or a dedicated OVP/OCP IC for this purpose.
  • A dead time of 100-200 ns is recommended to ensure proper switching and minimize shoot-through currents. The exact dead time may vary depending on the specific application and switching frequency.

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