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FFSH2065ADN-F155 - onsemi

Description: Max Junction Temperature 175°C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Pb−Free, Halogen Free/BFR Free and RoHS Compliant

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PCB Footprints
FFSH2065ADN-F155 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3LD CASE 340CH ISSUE A
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FFSH2065ADN-F155 - onsemi  - 3D model - Transistor Outline, Vertical - TO-247-3LD CASE 340CH ISSUE A
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FFSH2065ADN-F155 Details

  • Manufacturer Part Number:

    FFSH2065ADN-F155

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    580 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    13 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    93 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FFSH2065ADN-F155 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The device can withstand voltage stress up to 1.5 times the maximum rated voltage for a short duration. However, it's recommended to operate within the specified voltage range for reliable operation.
  • Yes, the FFSH2065ADN-F155 is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within its specified operating conditions and follow the recommended design guidelines.
  • Use a thermal imaging camera to identify hotspots, check for proper PCB layout and thermal design, and verify that the device is operated within its specified ratings. Also, consult the datasheet and application notes for troubleshooting guidelines.

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FFSH2065ADN-F155 Overview

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