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FGA20S120M - onsemi

Description: Trans IGBT Chip N-CH 1.2KV 40A 3-Pin(3+Tab) TO-3P(N) Rail - Bulk

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Symbol
FGA20S120M - onsemi - PCB symbol
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PCB Footprints
FGA20S120M - onsemi PCB footprint - Other - Other - TO 3PN _2022
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3D Models
FGA20S120M - onsemi - 3D model - Other - TO 3PN _2022
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FGA20S120M Details

  • Manufacturer Part Number:

    FGA20S120M

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, TO-3PN, 3 PIN

  • Manufacturer Package Code:

    340BZ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    40 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    865 ns

  • Turn-on Time-Nom (ton):

    301 ns

FGA20S120M Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FGA20S120M is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure that the device is operated within the recommended operating conditions.
  • A good PCB layout should prioritize thermal management, with a solid ground plane, minimal thermal resistance, and adequate heat sinking. Follow onsemi's recommended PCB layout guidelines and thermal management strategies for optimal performance.
  • To troubleshoot issues, start by verifying the device is properly biased and operated within recommended conditions. Check for thermal issues, ensure proper heat sinking, and verify the PCB layout meets recommended guidelines. Consult onsemi's application notes and technical support resources for further guidance.
  • Follow standard ESD protection procedures, such as using anti-static wrist straps, mats, and packaging materials. Handle the device by the body, avoiding direct contact with the pins or die. Consult onsemi's ESD handling guidelines for more information.

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FGA20S120M Overview

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