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FGA5065ADF - onsemi

Description: Obsolete - IGBT, 1000V, NPT Trench

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FGA5065ADF - onsemi - PCB symbol
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PCB Footprints
FGA5065ADF - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - FGA5065ADF
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3D Models
FGA5065ADF - onsemi - 3D model - Transistor Outline, Vertical - FGA5065ADF
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FGA5065ADF Details

  • Manufacturer Part Number:

    FGA5065ADF

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-3P-3L

  • Package Description:

    SC-65, TO-3PN, 3 PIN

  • Manufacturer Package Code:

    340BZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    100 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    7.6 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    268 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    GENERAL PURPOSE SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    80 ns

  • Turn-on Time-Nom (ton):

    57.6 ns

  • VCEsat-Max:

    2.2 V

FGA5065ADF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet. Make sure to provide a stable voltage supply, and use a suitable bias resistor to set the desired operating point. Additionally, ensure that the input and output impedances are matched to prevent signal reflections and distortion.
  • When selecting an external matching network, consider the device's input and output impedance, the operating frequency, and the desired gain and bandwidth. Use a Smith chart or a network analyzer to design and optimize the matching network. It's also important to consider the component tolerances and parasitic effects to ensure reliable performance.
  • To troubleshoot oscillations or instability, start by checking the PCB layout and ensuring that the device is properly biased and matched. Verify that the input and output impedances are matched, and that the device is not over-driven. Use a spectrum analyzer or an oscilloscope to identify the frequency of oscillation and to debug the issue. Consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • The FGA5065ADF is a robust device designed to operate in harsh environments. However, it's still important to consider reliability and ruggedness factors such as operating temperature, humidity, and power supply quality. Ensure that the device is operated within the recommended specifications, and follow proper handling and storage procedures to prevent damage. Consult the datasheet and reliability reports for more information.

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FGA5065ADF Overview

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