Part Image

FGD3040G2-F085 - onsemi

Description: SCIS Energy = 300mJ at TJ = 25°C; RoHS Compliant; Qualified to AEC Q101; Logic Level Gate Drive

Download FGD3040G2-F085 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FGD3040G2-F085 - onsemi PCB footprint - Other - Other - DP AK3 (TO−252 3 LD) CASE 369AS ISSUE O_FFW-4
click to zoom
3D Models
FGD3040G2-F085 - onsemi  - 3D model - Other - DP AK3 (TO−252 3 LD) CASE 369AS ISSUE O_FFW-4
click to zoom

FGD3040G2-F085 Details

  • Manufacturer Part Number:

    FGD3040G2-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252 3L (DPAK)

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    23.2 A

  • Collector-Emitter Voltage-Max:

    390 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Fall Time-Max (tf):

    15000 ns

  • Gate-Emitter Thr Voltage-Max:

    2.2 V

  • Gate-Emitter Voltage-Max:

    14 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    150 W

  • Rise Time-Max (tr):

    7000 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AUTOMOTIVE IGNITION

  • Transistor Element Material:

    SILICON

FGD3040G2-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • The maximum power dissipation of the FGD3040G2-F085 is 2.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • Yes, the FGD3040G2-F085 is suitable for high-frequency applications up to 5GHz. However, the device's performance may degrade at higher frequencies due to parasitic capacitance and inductance.
  • The device is sensitive to ESD. It is recommended to handle the device with an ESD wrist strap or mat, and to use ESD protection devices such as TVS diodes or ESD protection arrays in the circuit.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FGD3040G2-F085 Overview

Use the download button to access the FGD3040G2-F085 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FGD30, or try a keyword search, such as IGBTs

Parts related to FGD3040G2-F085

Showing 0 results

FGD3040G2-F085 Alternates

Showing results

Image Part Number Model
Part Image FGD3040G2_F085 onsemi

400V, 26A, 1.35V, 300mJ, DPAK EcoSPARK® II, N-Channel Ignition IGBT, TO-252 3L (DPAK), 5000-TAPE REEL