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FGD3050G2V - onsemi

Description: SCIS Energy = 300mJ at TJ = 25°C; Logic Level Gate Drive; Qualified to AEC Q101; RoHS Compliant

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FGD3050G2V - onsemi PCB footprint - Other - Other - FGD3050G2V-1
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FGD3050G2V Details

  • Manufacturer Part Number:

    FGD3050G2V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    32 A

  • Collector-Emitter Voltage-Max:

    500 V

  • Configuration:

    SINGLE WITH BUILT-IN TVS DIODE AND RESISTOR

  • Fall Time-Max (tf):

    15000 ns

  • Gate-Emitter Thr Voltage-Max:

    2.2 V

  • Gate-Emitter Voltage-Max:

    10 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    150 W

  • Reference Standard:

    AEC-Q101

  • Rise Time-Max (tr):

    7000 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AUTOMOTIVE IGNITION

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    30000 ns

  • Turn-off Time-Nom (toff):

    6800 ns

  • Turn-on Time-Max (ton):

    11000 ns

  • Turn-on Time-Nom (ton):

    2500 ns

  • VCEsat-Max:

    1.2 V

FGD3050G2V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The device requires a stable voltage supply and a bias circuit to set the gate-source voltage (Vgs) between 2V to 5V. A voltage regulator and a resistive divider network can be used to achieve this.
  • The maximum SOA is defined by the voltage and current ratings. The device can operate safely up to 30V drain-source voltage and 10A continuous drain current, with a maximum power dissipation of 100W.
  • Use an ESD protection circuit, such as a TVS diode or a zener diode, in parallel with the device to protect it from ESD events. Handle the device by the body or use an anti-static wrist strap to prevent ESD damage.
  • A gate drive circuit with a high-current, low-impedance driver and a gate resistor (Rg) between 10Ω to 100Ω is recommended. The driver should be able to provide a peak current of at least 1A to ensure fast switching.

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