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FGH25T120SMD_F155 - onsemi

Description: Fairchild FGH25T120SMD_F155, IGBT Transistor, 50 A 1200 V, 3-Pin TO-247

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PCB Footprints
FGH25T120SMD_F155 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247, MOLDED, 3-LEAD, JEDEC VARIATION AB
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3D Models
FGH25T120SMD_F155 - onsemi  - 3D model - Transistor Outline, Vertical - TO-247, MOLDED, 3-LEAD, JEDEC VARIATION AB
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FGH25T120SMD_F155 Details

  • Manufacturer Part Number:

    FGH25T120SMD_F155

  • Brand Name:

    ON Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Manufacturer Package Code:

    TO247G03

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    66 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    RC-IGBT

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    50 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    7.5 V

  • Gate-Emitter Voltage-Max:

    25 V

  • JEDEC-95 Code:

    TO-247AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    428 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    584 ns

  • Turn-on Time-Nom (ton):

    88 ns

  • VCEsat-Max:

    2.4 V

FGH25T120SMD_F155 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FGH25T120SMD_F155 is a 5.08mm x 6.1mm pad with a 1.5mm x 1.5mm thermal pad in the center, and a 0.5mm x 0.5mm solder mask opening.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum allowed voltage for FGH25T120SMD_F155 is 1200V, as specified in the datasheet. Exceeding this voltage may damage the component.
  • To prevent electrostatic discharge (ESD) damage, handle FGH25T120SMD_F155 components with an anti-static wrist strap or mat, and ensure that the PCB and assembly equipment are properly grounded.
  • The thermal resistance of FGH25T120SMD_F155 is typically around 1.5°C/W, but this value may vary depending on the specific application and PCB design.

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FGH25T120SMD_F155 Overview

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