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FGH75T65UPD - onsemi

Description: Positive temperaure co-efficient for parallel operation; Low saturation voltage: VCE(sat) = 1.65V (Typ.) at IC = 75A; High current capability; Tightened parameter distribution; Maximum junction temperature: TJ = 175°C; RoHS compliant; Short-circuit ruggedness: 5µs at 25°C; High-input impedance

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FGH75T65UPD Details

  • Manufacturer Part Number:

    FGH75T65UPD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Additional Feature:

    RC-IGBT

  • Collector Current-Max (IC):

    150 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Fall Time-Max (tf):

    33 ns

  • Gate-Emitter Thr Voltage-Max:

    7.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    375 W

  • Rise Time-Max (tr):

    56 ns

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    249 ns

  • Turn-off Time-Nom (toff):

    197 ns

  • Turn-on Time-Max (ton):

    98 ns

  • Turn-on Time-Nom (ton):

    87 ns

  • VCEsat-Max:

    2.3 V

FGH75T65UPD Frequently Asked Questions (FAQs)

  • The recommended gate resistor value is typically between 10Ω to 100Ω, depending on the specific application and switching frequency. A higher value can reduce EMI, but may slow down the switching speed.
  • Ensure good thermal contact between the IGBT and the heat sink. Apply a thin layer of thermal interface material, and secure the IGBT to the heat sink using screws or a clip. Also, consider the thermal resistance of the heat sink and the airflow around it.
  • The maximum allowed voltage imbalance is typically ±5% of the rated voltage (650V). Exceeding this can lead to uneven current distribution and reduced reliability.
  • Yes, the FGH75T65UPD can be used in resonant converter topologies, but ensure the design takes into account the IGBT's switching characteristics, such as the turn-on and turn-off times, to avoid overvoltage and ringing.
  • Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC. Also, consider adding a short-circuit protection circuit to detect and respond to fault conditions.

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FGH75T65UPD Overview

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