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FIN1019MTCX - onsemi

Description: Low power dissipation; 3.3V power supply operation; Fail safe protection open-circuit, shorted and terminated conditions; Greater than 400Mbs data rate; 2.5ns maximum propagation delay; 14-Lead SOIC and TSSOP packages save space; Flow-through pinout simplifies PCB layout; Power-Off protection; 100mV receiver input sensitivity; Meets or exceeds the TIA/EIA-644 LVDS standard; 0.5ns maximum differential pulse skew

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FIN1019MTCX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead, Thin Shrink Small Outline Package (TSSOP))_1
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FIN1019MTCX - onsemi  - 3D model - Small Outline Packages - 14-Lead, Thin Shrink Small Outline Package (TSSOP))_1
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FIN1019MTCX Details

  • Manufacturer Part Number:

    FIN1019MTCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Package Description:

    SOP-14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    2.5 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    12.5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.5 ns

  • Width:

    4.4 mm

FIN1019MTCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 10uF to 47uF values.
  • Use a shielded enclosure, keep the device and its components away from the PCB edge, and use a common-mode choke or ferrite bead on the input and output lines. Ensure proper grounding and decoupling.
  • The recommended input voltage range is 7V to 14V, with a maximum rating of 15V. Operating outside this range may affect the device's performance and reliability.

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