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FIN1027AMX - onsemi

Description: Greater than 600Mbs Data Rate ; 3V Power Supply Operation ; Flow-through Pinout Simplifies PCB Layout; Meets or Exceeds the TIA/EIA-644 LVDS Standard ; Low Power Dissipation ; 1.5ns Maximum Propagation Delay ; Power-Off Protection ; 0.5ns Maximum Differential Pulse Skew

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FIN1027AMX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC
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FIN1027AMX - onsemi  - 3D model - Small Outline Packages - SOIC
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FIN1027AMX Details

  • Manufacturer Part Number:

    FIN1027AMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.5 ns

  • Width:

    3.9 mm

FIN1027AMX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions and thermal design guidelines.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heat-sunk and the current is within the recommended operating conditions. Excessive current may lead to thermal shutdown or device damage.
  • Check the input voltage, output voltage, and current consumption. Verify the PCB layout and thermal design. Consult the datasheet and application notes for troubleshooting guidelines.

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FIN1027AMX Overview

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