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FIN1032MTCX - onsemi

Description: Meets or exceeds the TIA/EIA-644 LVDS standard; Greater than 400Mbs data rate; Low power dissipation; 2.5ns maximum propagation delay; Pin compatible with equivalent RS-422 and LVPECL devices; Fail safe protection for open-circuit, shorted and terminated conditions; 0.4ns maximum differential pulse skew; 16-Lead SOIC and TSSOP packages save space; 3.3V power supply operation; Power OFF protection

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FIN1032MTCX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MTC16
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FIN1032MTCX - onsemi  - 3D model - Small Outline Packages - MTC16
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FIN1032MTCX Details

  • Manufacturer Part Number:

    FIN1032MTCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16

  • Package Description:

    TSSOP-16

  • Manufacturer Package Code:

    948AH

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.008 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    2.5 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

FIN1032MTCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced lifespan, decreased performance, and potential device failure. Ensure the system design keeps the junction temperature below the recommended maximum of 150°C.
  • Use a robust power delivery system with a low-ESR capacitor and a high-current rating. Ensure the PCB traces and vias can handle the high current, and consider using a power plane or a dedicated power layer.
  • Implement proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Use a metal shield or a Faraday cage to enclose the device, and consider adding EMI filters or chokes to the power lines.

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FIN1032MTCX Overview

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