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FIN1104MTC - onsemi

Description: Greater than 800 Mbps data rate; Ultra low power consumption; 3.5 ps maximum random jitter and 135 ps maximum deterministic jitter; Meets or exceeds the TIA/EIA-644-A LVDS standard; Available in space saving 24-Lead TSSOP package; Power off protection; LVDS receiver inputs accept LVPECL, HSTL, and SSTL-2 directly; Wide rail-to-rail common mode range; >7.5 kV HBM ESD Protection; VBB >reference output; 20 ps typical channel-to-channel skew; Open circuit fail safe protection; 3.3V power supply operation

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FIN1104MTC - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MTC24_MO-153 (TSSOP)
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FIN1104MTC - onsemi  - 3D model - Small Outline Packages - MTC24_MO-153 (TSSOP)
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FIN1104MTC Details

  • Manufacturer Part Number:

    FIN1104MTC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSSOP-24

  • Package Description:

    TSSOP-24

  • Manufacturer Package Code:

    948AR

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-644-A; TIA-644-A

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1.75 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.75 ns

  • Width:

    4.4 mm

FIN1104MTC Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Use a heat sink, ensure good airflow, and consider derating the device's power handling at high temperatures. Also, ensure the PCB is designed to handle the thermal stresses.
  • Use a peak reflow temperature of 260°C (500°F) with a dwell time of 20-30 seconds. Avoid exceeding 280°C (536°F) to prevent damage to the device.
  • Use an ESD wrist strap or mat, handle the device by the package body, and avoid touching the pins. Use ESD-protected equipment and follow proper handling procedures.
  • Store the device in a dry, cool place (20°C to 30°C or 68°F to 86°F) with relative humidity below 60%. Avoid exposure to direct sunlight and moisture.

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FIN1104MTC Overview

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