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FIN1108MTD - onsemi

Description: Obsolete - LVDS 21-BitSerializers/De-Serializers

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FIN1108MTD - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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FIN1108MTD - onsemi  - 3D model - Small Outline Packages - 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for FIN1108MTD
  • Part Number FIN1108MTD
  • Manufacturer onsemi
  • Pin Count 48
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
  • Released Date Apr 13, 2015
  • Last Modified Date Jul 24, 2024 5:52 AM UTC
  • Pinout / Pin List Click Here (Member Only)

FIN1108MTD Details

  • Manufacturer Part Number:

    FIN1108MTD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-48

  • Manufacturer Package Code:

    948BQ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    8

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-644-A; TIA-644-A

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    8

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1.75 ns

  • Receiver Number of Bits:

    8

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.75 ns

  • Width:

    6.1 mm

FIN1108MTD Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure.
  • Yes, but ensure compliance with relevant industry standards (e.g., AS9100) and perform thorough testing and validation for the specific application.
  • Check for proper PCB layout, thermal management, and power supply quality. Verify that the device is operated within its specified ratings and consider using a thermal camera for debugging.

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FIN1108MTD Overview

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