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FIN1108MTDX - onsemi

Description: Greater than 800 Mbps data rate; 3.5 ps maximum random jitter and 135 ps maximum deterministic jitter; Ultra low power consumption; 3.3V power supply operation; 20 ps typical channel-to-channel skew; LVDS receiver inputs accept LVPECL, HSTL, and SSTL-2 directly; Open circuit fail safe protection; Wide rail-to-rail common mode range; >7.5 kV HBM ESD Protection; VBB >reference output; Available in space saving 48-lead TSSOP package; Meets or exceeds the TIA/EIA-644-A LVDS standard; Power off protection

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FIN1108MTDX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - tssop-48-6.1mm wide package number MTD48
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FIN1108MTDX - onsemi  - 3D model - Small Outline Packages - tssop-48-6.1mm wide package number MTD48
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FIN1108MTDX Details

  • Manufacturer Part Number:

    FIN1108MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-48

  • Package Description:

    TSSOP-48

  • Manufacturer Package Code:

    948BQ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    8

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-644-A; TIA-644-A

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    8

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1.75 ns

  • Receiver Number of Bits:

    8

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.75 ns

  • Width:

    6.1 mm

FIN1108MTDX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure proper grounding and decoupling. Implement EMI filters and shielding on the PCB if necessary.
  • Use a low-ESR capacitor (e.g., 10 μF) close to the device's power pins, and add additional decoupling capacitors (e.g., 100 nF) near the device. Ensure a stable, low-noise power supply with adequate voltage regulation.
  • Consult the datasheet for specific settings, but generally, set the internal regulators to the recommended values for the desired output voltage. Ensure the input voltage is within the recommended range.

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FIN1108MTDX Overview

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