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FIN1215MTDX - onsemi

Description: Internal PLL with no external component; 20 MHz to 85 MHz shift clock support; Devices are offered in 48-lead TSSOP packages; ±1V common-mode range around 1.2V; High throughput (up to 1.785 Gbps throughput); Compatible with TIA/EIA-644 specification; Narrow bus reduces cable size and cost; Low power consumption; Up to 595 Mbps per channel; 50% duty cycle on the clock output of receiver

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PCB Footprints
FIN1215MTDX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - tssop-48-6.1mm wide package number MTD48
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FIN1215MTDX - onsemi  - 3D model - Small Outline Packages - tssop-48-6.1mm wide package number MTD48
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FIN1215MTDX Details

  • Manufacturer Part Number:

    FIN1215MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-48

  • Package Description:

    MO-153ED, TSSOP-48

  • Manufacturer Package Code:

    948BQ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Differential Output:

    YES

  • Driver Number of Bits:

    3

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    SERIALIZER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    66 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

FIN1215MTDX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure safe operation.
  • Use a low-ESR output capacitor, minimize PCB trace inductance, and optimize the gate drive circuitry. Consider using a gate driver IC and a low-loss ferrite core inductor for improved efficiency.
  • Follow the onsemi recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds. For rework, use a low-temperature soldering iron and a thermal protection device to prevent overheating.

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FIN1215MTDX Overview

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SERIALIZER, 3 Func, 3 Driver, PDSO48