Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
Infineon recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK between the device and the heat sink. Additionally, ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
Infineon recommends powering up the device in the following sequence: VCC, then VBAT, and finally the input signals. This ensures that the internal voltage regulators are properly initialized.
Check the oscillator circuit for proper component values and layout. Ensure that the oscillator pins are not loaded with external components. If issues persist, try using an external oscillator or crystal to isolate the problem.
The maximum allowed voltage on the input pins is VCC + 0.5 V, but not exceeding 6.5 V. Exceeding this voltage may damage the device.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
FM31256-GTR Overview
Use the download button to access the FM31256-GTR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FM312,
or try a keyword search, such as FRAMs
