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FNB81560T3 - onsemi

Description: 600V - 15A 3-Phase IGBT Inverter Control IC for Gate Drive and Protections; Low-Loss, Short-Circuit Rated IGBTs; Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing; Active-high interface, works with 3.3 / 5 V Logic, Schmitt-trigger Input; HVIC for Gate Driving, Under-Voltage and Short-Circuit Current Protection; Fault Output for Under-Voltage and Short-Circuit Current Protection; Inter-Lock Function to Prevent Short-Circuit; Shut-Down Input; HVIC Temperature-Sensing Built-In for

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FNB81560T3 - onsemi  - 3D model
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FNB81560T3 Details

  • Manufacturer Part Number:

    FNB81560T3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP-025

  • Manufacturer Package Code:

    MODEZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-06-30

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T25

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

FNB81560T3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FNB81560T3 should prioritize thermal dissipation. Ensure a solid ground plane, use thermal vias, and keep the component away from heat sources. A 2-3 layer board with a dedicated thermal layer is recommended.
  • Choose an input capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. A 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric is a good starting point. Ensure the capacitor is rated for the input voltage and can handle the expected ripple current.
  • The maximum allowed voltage drop across the internal FETs is typically around 1.5V to 2V. Exceeding this limit can lead to reduced efficiency, increased heat, and potentially damage the device.
  • To ensure correct OCP triggering, use a sense resistor (Rs) with a low tolerance (e.g., 1%) and a high-power rating. The sense resistor should be placed close to the FNB81560T3 and connected to the OCP pin. Adjust the Rs value according to the desired overcurrent threshold.
  • The recommended operating temperature range for the FNB81560T3 is -40°C to 150°C. However, the device can operate up to 175°C for short periods during startup or fault conditions. Ensure proper thermal design and cooling to maintain a safe operating temperature.

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FNB81560T3 Overview

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