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FOD8160R2V - onsemi

Description: UL1577, 5,000 VACRMS for 1 minute; 20 kV/µs Minimum CMTI; Safety and regulatory approvals; Optoplanar ®packaging technology allows more than 10 mm creepage and clearance distance, and 0.5 mm insulation distance to achieve reliable and high voltage insulation; Specifications guaranteed over 3 V to 5.5 V supply voltage and -40 °C to 100 °C extended industrial temperature range; High Speed, 10 Mbit/sec Data Rate (NRZ); DIN-EN/IEC60747-5-5, 1,414 V peak working insulation voltage (pending approval); High noise

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FOD8160R2V - onsemi - PCB symbol
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FOD8160R2V - onsemi PCB footprint - Other - Other - FOD8160R2V-8
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FOD8160R2V Details

  • Manufacturer Part Number:

    FOD8160R2V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC5 (6) 3.95x9.20x2.55, 1.27P

  • Package Description:

    SOP-5

  • Manufacturer Package Code:

    752AF

  • Country Of Origin:

    Philippines

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    9

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    10 MBps

  • Forward Current-Max:

    0.025 A

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.085 W

  • Response Time-Nom:

    2e-8 ns

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD8160R2V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal interface material (TIM) for better heat transfer.
  • Use a shielded enclosure, keep cables and wires away from the device, and use EMI filters or ferrite beads on I/O lines. Ensure proper grounding and decoupling of power supplies.
  • Monitor output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to prevent device damage.
  • Use the shutdown pin to disable the device when not in use. Optimize the output voltage and current to minimize power losses. Consider using a low-dropout regulator (LDO) for better efficiency.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Verify output voltage, current, and ripple using an oscilloscope and a current probe. Perform load transient response testing to ensure stability.

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FOD8160R2V Overview

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