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FOD8321 - onsemi

Description: 2.5A Output Current, Gate Drive Optocoupler in Optoplanar® Wide Body SOP 5-Pin

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PCB Footprints
FOD8321 - onsemi PCB footprint - Other - Other - SOP 5-PIN
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3D Models
FOD8321 - onsemi  - 3D model - Other - SOP 5-PIN
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FOD8321 Details

  • Manufacturer Part Number:

    FOD8321

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC5 (6) 3.65x8.80x2.55, 1.27P

  • Package Description:

    SOP-6/5

  • Manufacturer Package Code:

    752AG

  • Country Of Origin:

    Philippines

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    9

  • Additional Feature:

    UL APPROVED

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    1.8 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    2.5 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.5 W

  • Response Time-Nom:

    6e-8 ns

  • Supply Voltage-Min:

    16 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

FOD8321 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FOD8321 involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the photodiode and the amplifier. A 4-layer PCB with a dedicated ground plane is recommended.
  • The FOD8321 requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and noise-free, and that the bias resistor is chosen to provide the recommended 10uA to 100uA bias current.
  • The FOD8321 is rated for operation from -40°C to 85°C. However, optimal performance is achieved between 0°C and 70°C. Ensure proper thermal management to maintain a stable temperature within this range.
  • The FOD8321 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Use a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. Avoid wave soldering or hand soldering, as this can damage the device. Ensure the PCB is properly cleaned and dried before soldering.

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FOD8321 Overview

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