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FOD8342R2 - onsemi

Description: FOD8342T - 8 mm Creepage and Clearance Distance, and 0.4 mm Insulation Distance to Achieve Reliable and High-Voltage Insulation; 3.0 A Peak Output Current Driving Capability for Medium-Power IGBT/MOSFET – Use of P-Channel MOSFETs at Output Stage Enables Output Voltage Swing Close to Supply Rail; 20 kV/µs Minimum Common Mode Rejection; Wide Supply Voltage Range: 10 V to 30 V; Fast Switching Speed Over Full Operating Temperature Range – 210 ns Maximum Propagation Delay – 65 ns Maximum Pulse Width Distortion;

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FOD8342R2 - onsemi - PCB symbol
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FOD8342R2 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC6 CASE 751EL ISSUE O
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FOD8342R2 - onsemi - 3D model - Small Outline Packages - SOIC6 CASE 751EL ISSUE O
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FOD8342R2 Details

  • Manufacturer Part Number:

    FOD8342R2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-6

  • Manufacturer Package Code:

    751EL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.025 A

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Shape:

    RECTANGULAR

  • Supply Voltage-Min:

    10 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD8342R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FOD8342R2 should minimize trace lengths, keep the input and output circuits separate, and use a ground plane to reduce noise and EMI. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure reliable operation over the full temperature range, ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermally conductive material for the PCB substrate.
  • The recommended input current for the FOD8342R2 is between 1mA and 10mA. Operating outside this range may affect the device's reliability and performance.
  • To protect the FOD8342R2 from ESD and overvoltage, use a TVS diode or a transient voltage suppressor on the input lines, and consider adding a series resistor to limit the input current. Additionally, ensure that the PCB is designed with ESD protection in mind.
  • The typical propagation delay for the FOD8342R2 is around 10-20 μs, but this can vary depending on the specific application and operating conditions. Consult the datasheet for more information.

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FOD8342R2 Overview

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