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FODM8801C - onsemi

Description: Applicable to Infrared Ray reflow, 245°C; Utilizing proprietary process technology to achieve high operating temperature up to 125°C; Guaranteed Current Transfer Ratio (CTR) specifications across full temperature range; > 5mm creepage and clearance distance; CTR at very low input current, IF; Excellent CTR linearity at high temperature; High isolation voltage regulated by safety agency, UL1577, 3750 VAC RMS for 1 min. and DIN EN/IEC60747-5-2 (pending approval); Compact half pitch, mini-flat, 4-pin package (

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FODM8801C - onsemi - PCB symbol
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PCB Footprints
FODM8801C - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MFP4 2.5X4.4, 1.27P CASE 100AL ISSUE O
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3D Models
FODM8801C - onsemi - 3D model - Small Outline Packages - MFP4 2.5X4.4, 1.27P CASE 100AL ISSUE O
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FODM8801C Details

  • Manufacturer Part Number:

    FODM8801C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    LEAD FREE, MINIFLAT-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    75 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    100%

  • Current Transfer Ratio-Nom:

    330%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.02 A

  • Forward Voltage-Max:

    1.8 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.00002 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

FODM8801C Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and away from noise sources.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V) and the output voltage is set to the desired level using the feedback resistors. Also, ensure the bias current is within the recommended range (1mA to 10mA).
  • The maximum allowable power dissipation for FODM8801C is 1.4W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range (-40°C to 125°C).
  • Use a voltage regulator or a voltage supervisor to ensure the input voltage is within the recommended range. Also, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • A 10uF to 22uF ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close as possible to the input pin.

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FODM8801C Overview

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