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FP0100N8-G - Microchip

Description: Power Switch ICs - Power Distribution FAULT PROTECT SWTCH W/CURRENT FOLD BCK

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FP0100N8-G - Microchip - PCB symbol
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PCB Footprints
FP0100N8-G - Microchip PCB footprint - Other - Other - FP0100N8-G-6
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3D Models
FP0100N8-G - Microchip - 3D model - Other - FP0100N8-G-6
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FP0100N8-G Details

  • Manufacturer Part Number:

    FP0100N8-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-89-3

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    15

  • Additional Feature:

    0 to 100V Differential input voltage available

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOF

  • Package Equivalence Code:

    TO-243

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    1.5 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2.445 mm

FP0100N8-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended PCB layout, but it's essential to follow good thermal design practices to ensure the device operates within its thermal specifications.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet. Use a stable voltage source, and ensure the input voltage is within the recommended range. Additionally, use a suitable decoupling capacitor to filter out noise and ensure a stable power supply.
  • Critical thermal design considerations include providing a sufficient heat sink, using thermal vias, and ensuring good airflow around the device. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • To troubleshoot issues, start by verifying the device is properly biased and the input voltage is within the recommended range. Check for any signs of physical damage or contamination. Use a thermal imaging camera or an infrared thermometer to monitor the device's temperature. If the issue persists, consult the datasheet and application notes for guidance or contact Microchip's technical support.
  • Follow the recommended soldering and assembly practices outlined in the datasheet and Microchip's application notes. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the device is handled by trained personnel to prevent damage. Use a solder with a melting point above 217°C to prevent thermal damage.

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FP0100N8-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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