Part Image

FP30R06KE3BPSA1 - Infineon

Description: IGBT Modules 600 V, 30 A PIM IGBT module

Download FP30R06KE3BPSA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
FP30R06KE3BPSA1 - Infineon  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

FP30R06KE3BPSA1 Details

  • Manufacturer Part Number:

    FP30R06KE3BPSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

FP30R06KE3BPSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance and ensure reliable operation.
  • When selecting a gate driver for the FP30R06KE3BPSA1, consider the driver's output current capability, voltage rating, and rise/fall times. Infineon recommends using a gate driver with a output current of at least 2A and a voltage rating of 15V or higher. Additionally, ensure the driver's rise/fall times are compatible with the MOSFET's switching frequency.
  • While the datasheet specifies a maximum drain-source voltage of 60V, Infineon recommends limiting voltage overshoots to 10% of the maximum voltage rating (i.e., 66V) to ensure reliable operation and prevent damage to the MOSFET.
  • To ensure SOA compliance, monitor the MOSFET's drain-source voltage, drain current, and junction temperature during operation. Use the datasheet's SOA curves to determine the maximum allowed drain current and voltage for a given junction temperature. Additionally, consider using a thermal monitoring system to prevent overheating.
  • Store the FP30R06KE3BPSA1 in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads to prevent electrostatic discharge (ESD) damage. Use anti-static packaging and follow proper ESD handling procedures when handling the device.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

FP30R06KE3BPSA1 Overview

Use the download button to access the FP30R06KE3BPSA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FP30R, or try a keyword search, such as IGBTs

Parts related to FP30R06KE3BPSA1

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview