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FPF1039UCX - onsemi

Description: 21 mΩ at VIN=4.5 V; • 1.2 to 5.5 V Input Voltage Operating Range • Typical RDS(ON):; 75 mΩ at VIN=1.2 V• Slew Rate/Inrush Control with tR: 2.7 ms (Typical)• 3 A Maximum Continuous Current Capability• Output Discharge Function • Low <1 µA Quiescent Current• ESD Protected: Above 8 kV HBM, 1.5 kV CDM• GPIO/CMOS-Compatible Enable Circuitry; 20 mΩ at VIN=5.5 V; 37 mΩ at VIN=1.8 V

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PCB Footprints
FPF1039UCX - onsemi PCB footprint - BGA - BGA - 6-Ball, 1.0 x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP)
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3D Models
FPF1039UCX - onsemi  - 3D model - BGA - 6-Ball, 1.0 x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP)
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FPF1039UCX Details

  • Manufacturer Part Number:

    FPF1039UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567RM

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.46 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

FPF1039UCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage (VIN) is within the recommended range (2.5V to 5.5V). Use a stable voltage source and decouple the input with a 1uF capacitor. Also, ensure the EN pin is properly biased to enable or disable the device.
  • The maximum current rating is 3A, but it's recommended to limit the current to 2A for optimal reliability and thermal performance.
  • The FPF1039UCX has a built-in thermal shutdown feature that disables the device when the junction temperature exceeds 150°C. Ensure proper thermal design and heat dissipation to prevent thermal shutdown. If thermal shutdown occurs, the device will automatically recover when the junction temperature drops below 130°C.
  • A 1uF to 10uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.

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FPF1039UCX Overview

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Part Image FPF1039UCX Fairchild Semiconductor Corporation

LOAD SWITCH, Fixed, 1 Channel, BGA6