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FPF1504LUCX - onsemi

Description: 1.0V to 3.6V Input Voltage Operating Range; Typical RDS(ON): 15mΩ at 3.3VIN; 20mΩ at 1.8VIN; 40mΩ at 1.0VIN; Slew Rate Control; Output Discharge Functionality; Low <1µA Quiescent Current at VON = VIN; ESD Protected: 4000V HBM, 2000V CDM; GPIO / CMOS - Compatible Enable Circuitry; Active High and Active Low Versions

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Symbol
FPF1504LUCX - onsemi - PCB symbol
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PCB Footprints
FPF1504LUCX - onsemi PCB footprint - BGA - BGA - WLCSP4 0.96x0.96x0.582 CASE 567RH ISSUE O
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3D Models
FPF1504LUCX - onsemi - 3D model - BGA - WLCSP4 0.96x0.96x0.582 CASE 567RH ISSUE O
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FPF1504LUCX Details

  • Manufacturer Part Number:

    FPF1504LUCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567RH

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.96 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

FPF1504LUCX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator can be used to regulate the input voltage, and a bias resistor can be used to set the operating point of the device.
  • The device is sensitive to electrostatic discharge (ESD) and can be damaged by excessive voltage or current. Handle the device by the body, avoid touching the pins, and use an ESD wrist strap or mat to prevent damage.
  • Use a multimeter to measure the input voltage, output voltage, and current consumption. Check the PCB layout for any errors or defects. Verify that the device is properly biased and that the input voltage is within the recommended range.
  • Yes, the input capacitor should be a low-ESR ceramic capacitor with a value of at least 1uF. The capacitor should be placed as close to the device as possible to minimize inductance and ensure stable operation.

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FPF1504LUCX Overview

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