Part Image

FPF1504UCX - onsemi

Description: 55 mΩ at VIN=1.0 V; ESD Protected: 4000 V HBM, 2000 V CDM; 1.0 V to 3.6 V Input Voltage Operating Range ; Low <1 µA Quiescent Current at VON=VIN; GPIO/CMOS-Compatible Enable Circuitry; Typical RDS(ON):; 20 mΩ at VIN=1.8 V; Slew Rate Control with tR: 130 µs; 15 mΩ at VIN=3.3 V; Output Discharge Function

Download FPF1504UCX Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FPF1504UCX - onsemi PCB footprint - BGA - BGA - WLCSP4 0.96x0.96x0.582 CASE 567RH ISSUE O
click to zoom
3D Models
FPF1504UCX - onsemi  - 3D model - BGA - WLCSP4 0.96x0.96x0.582 CASE 567RH ISSUE O
click to zoom

FPF1504UCX Details

  • Manufacturer Part Number:

    FPF1504UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567RH

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.96 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

FPF1504UCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heat-sinked and the current rating is not exceeded. The device can handle high currents, but thermal management is crucial to prevent overheating.
  • Check the input voltage, output voltage, and current. Verify the PCB layout and thermal design. Use a scope or logic analyzer to debug the device's behavior. Consult the datasheet and application notes for guidance.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FPF1504UCX Overview

Use the download button to access the FPF1504UCX schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FPF15, or try a keyword search, such as Power Management Circuits

Parts related to FPF1504UCX

Showing 0 results