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FQD12P10TM-F085 - onsemi

Description: Low Gate Charge; Improved dV/dT capability; AECQ-101 Qualified; RoHS compliant

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FQD12P10TM-F085 - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD)_2022-2
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FQD12P10TM-F085 Details

  • Manufacturer Part Number:

    FQD12P10TM-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    370 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    9.4 A

  • Drain-source On Resistance-Max:

    0.29 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    85 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    37.6 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    210 ns

  • Turn-on Time-Max (ton):

    370 ns

FQD12P10TM-F085 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FQD12P10TM-F085 is a 5x5mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation of FQD12P10TM-F085 in high-temperature environments, it is recommended to follow the thermal management guidelines provided in the datasheet, including using a heat sink and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of FQD12P10TM-F085 is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • No, FQD12P10TM-F085 is rated for a maximum current of 10A. If your design requires a higher current rating, you should consider using a different device or consulting with an onsemi application engineer for guidance.
  • To troubleshoot issues with FQD12P10TM-F085, start by reviewing the datasheet and application notes for proper usage and design guidelines. Check for proper thermal management, voltage and current ratings, and ensure that the device is used within its specified operating conditions.

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FQD12P10TM-F085 Overview

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