FQD13N06TM footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

FQD13N06TM - onsemi PCB footprint - Other - Other - D-PAk_2021.

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Datasheet Download Datasheet
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Part Number FQD13N06TM
Manufacturer onsemi
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - D-PAk_2021.
Released Date Jul 12, 2015
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

FQD13N06TM Details

Manufacturer Part Number:
FQD13N06TM
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
DPAK-3 / TO-252-3
Package Description:
DPAK-3
Manufacturer Package Code:
369AS
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
11 Weeks
Manufacturer:
onsemi
YTEOL:
0
Avalanche Energy Rating (Eas):
85 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
10 A
Drain-source On Resistance-Max:
0.14 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
2.5 W
Pulsed Drain Current-Max (IDM):
40 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

FQD13N06TM Frequently Asked Questions (FAQs)

The maximum junction temperature that the FQD13N06TM can withstand is 150°C.
To ensure the FQD13N06TM is properly biased, make sure to provide a gate-source voltage (Vgs) between 4V and 10V, and a drain-source voltage (Vds) within the recommended operating range.
For optimal thermal performance, use a PCB with a thermal pad and ensure good thermal conductivity between the device and the heat sink. Keep the drain and source pins as close as possible to minimize inductance.
Yes, the FQD13N06TM is suitable for high-frequency switching applications up to 1 MHz. However, ensure proper PCB layout and decoupling to minimize ringing and EMI.
Handle the FQD13N06TM with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. Use an ESD-protected workstation and wear an ESD strap when handling the device.

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FQD13N06TM Overview

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