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FQD19N10LTM - onsemi

Description: 15.6A, 100V, RDS(on) = 100mΩ(Max.) @VGS = 10 V, ID = 7.8A; Low gate charge ( Typ. 14nC); 100% avalanche tested; Low Crss ( Typ. 35pF)

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PCB Footprints
FQD19N10LTM - onsemi PCB footprint - Other - Other - TO252 (D-PAK)
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FQD19N10LTM - onsemi  - 3D model - Other - TO252 (D-PAK)
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FQD19N10LTM Details

  • Manufacturer Part Number:

    FQD19N10LTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    220 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    15.6 A

  • Drain-source On Resistance-Max:

    0.11 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    45 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    62.4 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    340 ns

  • Turn-on Time-Max (ton):

    868 ns

FQD19N10LTM Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FQD19N10LTM is -55°C to 150°C.
  • To ensure proper biasing, the FQD19N10LTM requires a gate-source voltage (Vgs) between 2V and 5V, and a drain-source voltage (Vds) between 10V and 100V.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and a heat sink. The device should be placed on a copper plane with a minimum size of 1 inch x 1 inch, and the thermal pad should be connected to a heat sink with a thermal interface material.
  • To protect the FQD19N10LTM from ESD, it is recommended to use an ESD protection device, such as a TVS diode, and to follow proper handling and storage procedures to prevent ESD damage.
  • The maximum current rating for the FQD19N10LTM is 19A.

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FQD19N10LTM Overview

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Part Image FQD19N10LTM Rochester Electronics LLC

15.6A, 100V, 0.11ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252, DPAK-3

Part Image FQD19N10LTM Fairchild Semiconductor Corporation

Power Field-Effect Transistor, 15.6A I(D), 100V, 0.11ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252