Part Image

FQD1N60CTM - onsemi

Description: 1A, 600V, RDS(on) = 11.5Ω(Max.) @VGS = 10 V, ID = 0.5A; RoHS compliant; 100% avalanche tested; Low Crss ( Typ. 3.5pF); Low gate charge ( Typ. 4.8nC)

Download FQD1N60CTM Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FQD1N60CTM - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_2
click to zoom

FQD1N60CTM Details

  • Manufacturer Part Number:

    FQD1N60CTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    33 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    11.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    28 W

  • Pulsed Drain Current-Max (IDM):

    4 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FQD1N60CTM Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for FQD1N60CTM is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for voltage and current, and to provide adequate heat sinking to maintain a safe junction temperature.
  • The maximum allowable power dissipation for FQD1N60CTM is 125W at a case temperature of 25°C.
  • To protect FQD1N60CTM from ESD, handle the device with anti-static wrist straps, mats, or bags, and ensure that the device is stored in a static-shielding bag or tube.
  • The recommended soldering temperature profile for FQD1N60CTM is a peak temperature of 260°C for 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FQD1N60CTM Overview

Use the download button to access the FQD1N60CTM schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like FQD1N, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FQD1N60CTM

Showing 0 results