Part Image

FQD5N60CTM - onsemi

Description: Low Crss ( Typ. 6.5pF); 2.8A, 600V, RDS(on) = 2.5Ω(Max.) @VGS = 10 V, ID = 1.4A; RoHS compliant; 100% avalanche tested; Low gate charge ( Typ. 15nC)

Download FQD5N60CTM Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FQD5N60CTM - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_1
click to zoom
3D Models
FQD5N60CTM - onsemi  - 3D model - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_1
click to zoom

FQD5N60CTM Details

  • Manufacturer Part Number:

    FQD5N60CTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.3

  • Avalanche Energy Rating (Eas):

    210 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    2.8 A

  • Drain-source On Resistance-Max:

    2.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    49 W

  • Pulsed Drain Current-Max (IDM):

    11.2 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FQD5N60CTM Frequently Asked Questions (FAQs)

  • The recommended gate resistor value for FQD5N60CTM is typically in the range of 1 kΩ to 10 kΩ, depending on the specific application and switching frequency.
  • To ensure proper cooling, it is recommended to attach a heat sink to the device, and ensure good thermal contact between the device and heat sink. The heat sink should be designed to dissipate the maximum expected power loss.
  • The maximum allowed voltage transient for FQD5N60CTM is typically 650 V, but it's recommended to limit the voltage transient to 600 V or less to ensure reliable operation.
  • Yes, FQD5N60CTM is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate drive requirements, and thermal management when designing the application.
  • To protect the FQD5N60CTM from ESD, it's recommended to handle the device with anti-static precautions, such as using an anti-static wrist strap or mat, and storing the device in an anti-static package.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FQD5N60CTM Overview

Use the download button to access the FQD5N60CTM schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FQD5N, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FQD5N60CTM

Showing 0 results