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FQD6N50CTM - onsemi

Description: N-Channel 500 V 4.5A (Tc) 2.5W (Ta), 61W (Tc) Surface Mount TO-252AA

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PCB Footprints
FQD6N50CTM - onsemi PCB footprint - Other - Other - TO-252 3L (DPAK)_2025-1
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FQD6N50CTM Details

  • Manufacturer Part Number:

    FQD6N50CTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    300 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    1.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    61 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    220 ns

  • Turn-on Time-Max (ton):

    110 ns

FQD6N50CTM Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FQD6N50CTM is a TO-252 (D-PAK) package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 10°C/W is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K should be used to fill the gap between the device and the heat sink.
  • The maximum allowed voltage on the gate of FQD6N50CTM is ±20V, with a recommended maximum voltage of ±15V for reliable operation.
  • To protect the FQD6N50CTM from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the device is stored in an anti-static bag or container. Additionally, use ESD-sensitive handling procedures during assembly and testing.
  • A gate driver with a peak current capability of at least 1A and a voltage rating of at least 15V is recommended. The driver should also have a low output impedance to ensure fast switching times.

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FQD6N50CTM Overview

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