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FQP9N30 - onsemi

Description: Obsolete - Power MOSFET, N-Channel, QFET, 500 V, 9 A, 800 mΩ, TO-220

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PCB Footprints
FQP9N30 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 3L_1
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3D Models
FQP9N30 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 3L_1
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FQP9N30 Details

  • Manufacturer Part Number:

    FQP9N30

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    420 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.45 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    98 W

  • Pulsed Drain Current-Max (IDM):

    36 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FQP9N30 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the FQP9N30 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general guideline, the SOA is typically limited by the device's thermal resistance, voltage rating, and current handling capability. For the FQP9N30, the SOA is approximately 10A at 30V, but this may vary depending on the specific application and operating conditions.
  • To ensure the FQP9N30 is properly biased for optimal performance, follow these guidelines: 1) Ensure the gate-source voltage (Vgs) is within the recommended range of 2-4V for optimal switching performance. 2) Use a suitable gate driver or voltage source to provide a clean, low-impedance signal to the gate terminal. 3) Ensure the drain-source voltage (Vds) is within the recommended range of 0-30V. 4) Use a suitable heat sink or thermal management system to maintain a safe operating temperature.
  • For optimal performance and reliability, follow these PCB layout and thermal management guidelines: 1) Use a multi-layer PCB with a solid ground plane to reduce thermal resistance and electromagnetic interference (EMI). 2) Place the FQP9N30 near a heat sink or thermal pad to facilitate heat dissipation. 3) Use thermal vias or thermal pads to connect the device to the heat sink or thermal pad. 4) Ensure good thermal conductivity between the device and heat sink or thermal pad using thermal interface materials (TIMs) or thermal grease.
  • To handle ESD protection for the FQP9N30, follow these guidelines: 1) Use ESD-sensitive handling procedures when handling the device. 2) Use ESD-protective packaging and storage materials. 3) Implement ESD protection circuits or devices, such as TVS diodes or ESD protection arrays, in the system design. 4) Ensure the system design includes adequate ESD protection for the entire signal path, including the FQP9N30 and associated components.
  • The reliability and lifetime expectations for the FQP9N30 are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. However, as a general guideline, the FQP9N30 is designed to meet the following reliability and lifetime expectations: 1) Mean time to failure (MTTF) of 100,000 hours or more. 2) Failure rate of less than 1 FIT (failure in time) per billion hours. 3) Operating lifetime of 10-20 years or more, depending on the application and operating conditions.

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FQP9N30 Overview

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