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FS15R12VT3 - Infineon

Description: Infineon FS15R12VT3, IGBT Module, 3 Phase, 24 A max, 1200 V, 11-Pin EASY750

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Symbol
FS15R12VT3 - Infineon - PCB symbol
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PCB Footprints
FS15R12VT3 - Infineon PCB footprint - Other - Other - FS15R12VT3-2
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3D Models
FS15R12VT3 - Infineon - 3D model - Other - FS15R12VT3-2
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FS15R12VT3 Details

  • Manufacturer Part Number:

    FS15R12VT3

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MODULE

  • Pin Count:

    11

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    24 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X11

  • Number of Elements:

    6

  • Number of Terminals:

    11

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    86 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    590 ns

  • Turn-on Time-Nom (ton):

    72 ns

  • VCEsat-Max:

    2.15 V

FS15R12VT3 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FS15R12VT3 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, such as using a heat sink, and ensuring good airflow around the device.
  • The maximum current rating for the FS15R12VT3 is 15A, but it's essential to consider the device's thermal limitations and ensure proper cooling to prevent overheating.
  • To protect the FS15R12VT3, it's recommended to use overvoltage protection (OVP) and overcurrent protection (OCP) circuits, as well as a fuse or a current limiter to prevent damage from excessive current.
  • The recommended PCB layout and thermal design for the FS15R12VT3 involves using a multi-layer PCB with a solid ground plane, placing the device near a heat sink, and ensuring good thermal conductivity between the device and the heat sink.

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FS15R12VT3 Overview

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