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FS200R07N3E4R - Infineon

Description: 650 V, 200 A sixpack IGBT module

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FS200R07N3E4R - Infineon PCB footprint - Other - Other - FS200R07N3E4R-2
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3D Models
FS200R07N3E4R - Infineon  - 3D model - Other - FS200R07N3E4R-2
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FS200R07N3E4R Details

  • Manufacturer Part Number:

    FS200R07N3E4R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Pin Count:

    35

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    200 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    COMPLEX

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X35

  • Number of Elements:

    6

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    600 W

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    450 ns

  • Turn-on Time-Nom (ton):

    210 ns

  • VCEsat-Max:

    1.95 V

FS200R07N3E4R Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FS200R07N3E4R is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, such as using a heat sink, and ensuring good airflow around the device.
  • The maximum current rating for the FS200R07N3E4R is 200A, but it's essential to consider the device's thermal limitations and ensure proper cooling to prevent overheating.
  • Yes, you can use multiple FS200R07N3E4R devices in parallel to increase current handling, but it's crucial to ensure proper synchronization and thermal management to prevent uneven current distribution.
  • To protect the FS200R07N3E4R, you can use overvoltage protection (OVP) and overcurrent protection (OCP) circuits, as well as ensure proper PCB layout and design to minimize parasitic inductance and capacitance.

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