BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Gate-Emitter Voltage-Max:
20 V
JESD-30 Code:
R-XUFM-X28
Number of Elements:
6
Number of Terminals:
28
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
145 W
Qualification Status:
Not Qualified
Surface Mount:
NO
Terminal Form:
UNSPECIFIED
Terminal Position:
UPPER
Transistor Element Material:
SILICON
Turn-off Time-Nom (toff):
610 ns
Turn-on Time-Nom (ton):
140 ns
VCEsat-Max:
2.1 V
FS25R12KE3G Frequently Asked Questions (FAQs)
The maximum operating temperature range for the FS25R12KE3G is -40°C to 150°C, with a junction temperature (Tj) of up to 175°C.
To ensure reliability, follow the recommended thermal design and layout guidelines, use a suitable heat sink, and ensure proper cooling. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature.
The recommended gate drive voltage for the FS25R12KE3G is between 10V and 15V, with a maximum gate-source voltage (Vgs) of ±20V.
Yes, the FS25R12KE3G can be used in a parallel configuration to increase power handling. However, ensure that the devices are properly matched, and the gate drive and layout are designed to minimize differences in switching times and thermal performance.
The maximum allowed dv/dt for the FS25R12KE3G is 50V/ns, with a recommended value of 10V/ns to minimize electromagnetic interference (EMI) and ensure reliable operation.
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FS25R12KE3G Overview
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