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FS820R08A6P2B - Infineon

Description: Trans IGBT Module N-CH 750V 820A

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FS820R08A6P2B - Infineon  - 3D model
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FS820R08A6P2B Details

  • Manufacturer Part Number:

    FS820R08A6P2B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Germany, Hungary

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    13

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    820 A

  • Collector-Emitter Voltage-Max:

    750 V

  • Configuration:

    3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X33

  • Number of Elements:

    6

  • Number of Terminals:

    33

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    714 W

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1110 ns

  • Turn-on Time-Nom (ton):

    380 ns

  • VCEsat-Max:

    1.35 V

FS820R08A6P2B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FS820R08A6P2B is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and design, including using a multi-layer board, minimizing track lengths, and using decoupling capacitors.
  • To troubleshoot issues, start by checking the device's operating conditions, ensuring proper thermal management, and verifying the PCB layout and design. If issues persist, consult Infineon's application notes and technical support resources.
  • Follow Infineon's recommended soldering and assembly guidelines, including using a soldering iron with a temperature range of 220°C to 250°C, and ensuring proper handling and storage of the device.

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FS820R08A6P2B Overview

Use the download button to access the FS820R08A6P2B 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FS820, or try a keyword search, such as IGBTs

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