FSB50550US footprint, schematic symbol and 3D model by onsemi

Symbol

click to zoom

PCB Footprints

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for FSB50550US
Part Number FSB50550US
Manufacturer onsemi
Pin Count 23
Part Category Accelerometer
Package Category Small Outline Packages
Footprint Name Small Outline Packages - SOP23
Last Modified Date Apr 7, 2026 12:33 PM UTC
Pinout / Pin List Click Here (Member Only)

FSB50550US Details

Manufacturer Part Number:
FSB50550US
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
Part Package Code:
SMD-023
Package Description:
ROHS COMPLIANT, SPM-23
Manufacturer Package Code:
MODEM
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
14 Weeks
Manufacturer:
onsemi
YTEOL:
3
Analog IC - Other Type:
AC MOTOR CONTROLLER
JESD-30 Code:
R-PDSO-G23
JESD-609 Code:
e3
Length:
29 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
23
Output Current-Max:
5 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
MODULE,23LEAD,0.7
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Seated Height-Max:
3.3 mm
Supply Voltage-Max (Vsup):
16.5 V
Supply Voltage-Min (Vsup):
13.5 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
3.9 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
12 mm

FSB50550US Frequently Asked Questions (FAQs)

The maximum junction temperature (Tj) that the FSB50550US can withstand is 150°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 125°C for reliable operation and to prevent thermal runaway.
To ensure the FSB50550US is properly biased, make sure to follow the recommended biasing scheme in the datasheet. This typically involves connecting the gate to a voltage source through a resistor and capacitor, and ensuring the drain-source voltage is within the recommended range.
For optimal thermal management, it's recommended to use a multi-layer PCB with a thermal pad connected to a heat sink or a thermal interface material. The datasheet provides guidelines for PCB layout and thermal management, including recommended pad sizes and thermal resistance values.
Yes, the FSB50550US is designed for high-frequency switching applications up to 1 MHz. However, it's essential to ensure the device is properly biased and the PCB layout is optimized for high-frequency operation to minimize losses and prevent overheating.
To protect the FSB50550US from overvoltage and overcurrent conditions, it's recommended to use a voltage regulator or a voltage clamp to limit the voltage across the device. Additionally, consider using a current sense resistor and a fuse or a current limiter to prevent overcurrent conditions.

Trust Checks

System Verified

FSB50550US Overview

Use the download button to access the FSB50550US schematic symbol and PCB footprint.

To find more CAD model downloads similar to this part, try a partial part number search, like FSB50, or try a keyword search, such as Motion Control Electronics

Parts related to FSB50550US

Showing 0 results